OSRAM's first batch of LED chips on silicon is expected to be launched in two years
The R&D staff at OSRAM Opto Semiconductors successfully produced a high-performance blue-and-white LED prototype with a gallium nitride light-emitting layer grown on a 150 mm diameter silicon wafer. This wafer replaces the currently used sapphire with silicon, achieving equal quality. This new LED chip has entered the pilot phase and will be tested under actual conditions, which means that OSRAM Opto Semiconductors' first silicon LED chips are expected to be launched within two years.
Because silicon is widely used in the semiconductor industry and can achieve larger wafer diameters, coupled with its superior thermal management characteristics, the lighting market will eventually choose to be such an attractive and cost-effective material. In addition, the quality and performance data of the company's LED silicon chips is comparable to that of sapphire-based chips: the Blu-ray UX:3 chip in the standard Golden Dragon Plus LED package has a brightness of 634 mW at 3.15V, which is equivalent to 58% of the light. effect. These are the higher values ​​that a 1mm2 chip can achieve at 350mA. In other words, if combined with traditional phosphor conversion in a standard package, these white LED prototypes will have a brightness of 140 lm at 350 mA and a light efficiency of 127 lm/W at a color temperature of 4500K.
Osram stressed that from the mathematical theory, 17,000 1mm2 LED chips can be fabricated on wafers with a diameter of 150mm (6 inches). The larger the silicon wafer, the higher the productivity; OSRAM R&D personnel have shown the world's first 200mm (about 8 inches) silicon-based structure.
　　
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